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China Shenzhen Learnew Optoelectronics Technology Co., Ltd. certification
China Shenzhen Learnew Optoelectronics Technology Co., Ltd. certification
Customer Reviews
August 25, 2023, I purchased UVA LED chips from Learnew. Learnew delivered the custom UVA chips we requested quickly and with excellent workmanship. It was a pleasure to work with Learnew. He was able to tell me exactly which product would work with my curing printer, saving me a lot of time. They are very professional.

—— Ashraf Trading

October 13, 2023,I received a customized 3535 COB LED Chip .Their attention to detail, timely responses, and on-time delivery have exceeded my expectation.The sample I received is what I need, very bright, I will choose LEARNEW for a long time in the future

—— Hector Bustillo

March 2024,Just received the product and have tried it,The design of these Hight LED chips is outstanding. They are compact, easy to install, and provide excellent illumination. I am extremely satisfied with their performance!

—— Fabio Antista

I am thoroughly impressed with the functionality of these UV LED chips. They offer reliable UV output, high efficiency, and a long lifespan. A great investment for any UV application!

—— Ali Muhammad

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high power led chip online manufacture

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buy White + Warm White Bi Color LED Chips With PCB Aluminum Radiators High Power Chip Beads 18w 24w 25w 30w online manufacturer

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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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