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China Shenzhen Learnew Optoelectronics Technology Co., Ltd. certification
China Shenzhen Learnew Optoelectronics Technology Co., Ltd. certification
Customer Reviews
August 25, 2023, I purchased UVA LED chips from Learnew. Learnew delivered the custom UVA chips we requested quickly and with excellent workmanship. It was a pleasure to work with Learnew. He was able to tell me exactly which product would work with my curing printer, saving me a lot of time. They are very professional.

—— Ashraf Trading

October 13, 2023,I received a customized 3535 COB LED Chip .Their attention to detail, timely responses, and on-time delivery have exceeded my expectation.The sample I received is what I need, very bright, I will choose LEARNEW for a long time in the future

—— Hector Bustillo

March 2024,Just received the product and have tried it,The design of these Hight LED chips is outstanding. They are compact, easy to install, and provide excellent illumination. I am extremely satisfied with their performance!

—— Fabio Antista

I am thoroughly impressed with the functionality of these UV LED chips. They offer reliable UV output, high efficiency, and a long lifespan. A great investment for any UV application!

—— Ali Muhammad

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1200w cob led chip online manufacture

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buy High lumen power red Warm white + positive white 18a-21a 1200w +1200w smd led chip 120*100 COB Chip Photography light online manufacturer

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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Learnew 1200W UV LED System Switching signal Dimming 0-1200W Water cooling AC220V High power SMD or COB for UV Curing 1200W UV LED Systems specifications POWER Dominant Wavelength Optical Intensity Recommend ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ... Read More
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