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—— Ashraf Trading
—— Hector Bustillo
—— Fabio Antista
—— Ali Muhammad
This is a new product launched by LEARNEW, which adopts the NCSP process technology.
The use of NCSP process has several advantages.
First, since non-conductive solder paste does not form a conductive connection, it can reduce the risk of short circuits on the circuit board.
Second, non-conductive solder paste can achieve smaller solder joint spacing in high-density circuit boards, thereby increasing the assembly density of circuit boards.
In addition, the NCSP process can also provide better thermal performance and lower welding stress, which helps to improve the reliability and life of electronic components.